高端内存使用的内存颗粒列表

答案：
　　列出了很多易做图内存所使用的颗粒,看得懂的就看吧,希望对大家有点帮助 


A-DATA 

A-DATA PC2700 (CAS 2.5): Samsung TCB3, TCC4, CCC...almost anything 
A-DATA PC3200 (CAS 2.5): Samsung TCB3, TCC4, CCC...almost anything 
A-DATA PC3200 Special Edition: Winbond BH-5 (not in prodUCtion anymore) 
A-DATA PC4000 (CAS 3): Hynix D43 
A-DATA Vitesta PC4000 (CAS 3): Hynix D5 


Buffalo 

Buffalo PC2700 (CAS 2.5): Infineon, Micron, Samsung chips...almost anything 
Buffalo PC3200 (CAS 3): Infineon, Micron, Samsung chips...almost anything 
Buffalo PC3500: Infineon, Micron, Samsung chips...had Micron mT -5B C recently 
Buffalo FireStix PC3500 (3-3-3-8): Hynix B...had Micron mT -5B C recently 
Buffalo PC3700: Old stuff had Winbond BH-5...had Micron mT -5B C recently 
Buffalo FireStix PC4000 (3-4-4-8): Hynix B 


Corsair (most of the info is from minnyboy's post at Corsair forums) 

Corsair XMS-PC2700C2: Micron (6ns) 
Corsair XMS-PC2700LL (2-2-2-6): Samsung TCB3, then Winbond BH-6, rare but existent with Winbond BH-5, all Winbond CH-6 now 
Corsair XMS-PC3200C2 rev1.1, 2.1, 3.1: Winbond BH-6 or Winbond BH-5 (not in production anymore) 
Corsair XMS-PC3200C2 rev4.1: (some) Samsung TCCD revF 
Corsair XMS-PC3200C2 rev1.2, 2.2 (2-3-3-6): Winbond CH-5, rarely Winbond CH-6 
Corsair XMS-PC3200LL rev1.1, 2.1 (2-2-2-6): Winbond BH-5 (not in production anymore) 
Corsair XMS-PC3200LL rev1.2, 2.2 (2-3-2-6): Winbond CH-5 
Corsair XMS-PC3200XL (2-2-2-5): Samsung TCCD revF 
Corsair XMS-PC3500C2 rev1.1 (2-3-3-7): Winbond BH-5 (except registered dimms) (not in production anymore) 
Corsair XMS-PC3700: Samsung -5 Rev E (TCCC) 
Corsair XMS-PC4000 (3-4-4-8): Hynix D43 rev.b 
Corsair XMS-PC4400 (3-4-4-8): Hynix D5 

                        

Crucial 

Crucial Ballistix PC3200 (2-2-2-5 1T): Micron mT -5B G 
Crucial Ballistix PC4000 (2.5-2-3-8 1T): Micron mT -5B G 


Geil 

Geil Value PC3200 Blue (2.5-3-3-6 for 256MB & 512MB sticks, 3-4-4-8 for 1024MB sticks): Most are Infineon chips, very few are Hynix 
Geil Golden Dragon PC3200 (2-3-3-6): Using WLCSP chip package w/ Samsung chips 
Geil Ultra Platinum PC3200 (2-3-3-6): Used to be Winbond CH-5, now could be Mosel chips 
Geil Ultra X PC3200 (2-2-2-5): Samsung TCCD revF 
Geil Golden Dragon PC3500 (2.5-3-3-6): Using WLCSP chip package w/ Samsung chips 
Geil Ultra Platinum PC3500 (2.5-3-3-6): Used to be Winbond CH-5, now could be Mosel chips 
Geil Golden Dragon PC3700 (2.5-4-4-7): Using WLCSP chip package w/ Samsung chips 
Geil Golden Dragon PC4000 (2.5-4-4-7): Using WLCSP chip package w/ Samsung chips 
Geil Ultra Platinum PC4000 (3-4-4-8): Hynix D43 
Geil Ultra Platinum PC4200 (3-4-4-8): Hynix D43 
Geil Ultra Platinum PC4400 (3-4-4-8): Hynix D5 


G.Skill 

G.Skill TCCD (2-2-2-5 @ DDR400, 2.5-3-3-6 @ DDR500, 3-4-4-8 @ DDR560): Samsung TCCD revF 


Kingston (most info is from this link) 

KHX PC2700 (2-2-2-5): Samsung TCB3, rare but existent with Winbond BH-6, all Winbond CH-6 now 
KHX PC3000 (2-2-2-6): Samsung TCB-3 at first, rare but existent with original Winbond BH-5, Kingston re-marked chips (see below for re-marked chips) all Winbond CH-5 or CH-6 now (not in production anymore) 
KHX PC3200 (2-2-2-6): Winbond BH-5 (except 1GB sticks) (not in production anymore) 
KHX PC3200A (2-3-2-6): Used to be Winbond CH-5, has whatever can run at rated speed like Infineon, Hynix, etc. 
KHX PC3200UL (2-2-2-5): Samsung TCCD revF 
KHX PC3500 (2-3-3-7): Really old stuff is Winbond BH-5, majority is Winbond CH-5 
KHX PC4000 (3-4-4-8): Samsung TCCC, some being switched to Hynix D43, some may even be HyniX D5 


                        
            
            [page_break]                                    KHX PC4200 (3-4-4-8): Hynix D5 
KHX PC4300 (3-4-4-8): Hynix CT-D43 at first, Hynix DT-D5 by now 
KVR PC2700 (CAS 2.5): Hynix BT-D43, Winbond BH-6, re-marked...almost anything 
KVR PC3200 (CAS 2.5): Hynix BT-D43, Winbond BH-5, Winbond CH-5, re-marked...almost anything 

Re-marked as D328DW-45, D328DW-50, or D328DW-60: Winbond BH-5, Winbond BH-6, mostly Winbond CH-5 and CH-6 for later date codes 


Mushkin 

Mushkin Promo build (2-2-2): Winbond BH-5 (not in production anymore) 
Mushkin PC3200 Level I (2-3-2): Used to be Winbond CH-5, has Mosel Vitelic now 
Mushkin PC3200 Level II (2-2-2): Winbond BH-5 (not in production anymore) 
Mushkin PC3200 Level II V2 (2-2-2): Samsung TCCD revF 
Mushkin PC3200 Special 222 (2-2-2): Winbond BH-6 (not in production anymore) 
Mushkin PC3500 Level I (2-3-3): Winbond CH-5 
Mushkin PC3500 Level II (2-2-2): Winbond BH-5 (not in production anymore) 


OCZ (OCZ EB is speed-binned so EB PC3700 is the best) 

OCZ EB PC3200 (2.5-3-2-8): Micron mT -5B C 
OCZ EL PC3200 Platinum (2-3-2-5): Used to be Winbond CH-5, has Mosel Vitelic now 
OCZ EL PC3200 Platinum LE (2-2-2-7): Winbond BH-6 (not in production anymore) 
OCZ EL PC3200 Platinum Rev2 (2-2-2-8): Samsung TCCD revF (Brain Power PCB) 
OCZ EL PC3200 Gold VX (2-3-3-8 @ 2.6V, 2-2-2-8 @ 3.2V): ??? 
OCZ EB PC3500 (2.5-3-2-8): Micron mT -5B C (not in production anymore) 
OCZ EL PC3500 (2-3-3-6): Winbond CH-5, some Winbond BH-5 in past 
OCZ EL PC3500 Platinum LE (2-3-2-6): Winbond BH-5 (Brain Power PCB, not in production anymore) 
OCZ EB PC3700 (3-3-2-8): Micron -5B C (not in production anymore) 
OCZ EL PC3700 (2.5-4-4-7): Samsung TCB3, rev2 uses ProMos/Mosel 
OCZ EL PC3700 Platinum (2-3-3-8): Samsung TCCD revF (Brain Power PCB) 

                        OCZ EL PC3700 Gold Rev3 (2.5-3-3-8): Hynix DT-D5 

            
              
                 
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            [page_break]            OCZ EL PC4000 (3-4-4-8): Hynix D43 
OCZ EL PC4000 Gold (2.5-4-4-8): Hynix BT-D5, Hynix CT-D5 
OCZ EL PC4000 Gold Rev2 (2.5-3-3-8): Hynix DT-D5 
OCZ EL PC4200 (3-4-4-8): Hynix D43 or Hynix D5 
OCZ EL PC4200 Platinum (2.5-3-3-8): Samsung TCCD revF 
OCZ EL PC4400 (3-4-4-8): Hynix D5 
OCZ EL PC4400 Gold (2.5-4-4-8): Hynix B 


PQI 

PQI Turb PC3200 (2-2-2-5): Samsung TCCD revF (Brain Power PCB) 


Shikatronics 

ShikaXRAM PC4400 (3-4-4-8): Hynix B 


SimpleTech 

SimpleTech Nitro PC4000 (CAS 3): Hynix D5 (newer chips rated for 2.6V operation) 


TwinMOS 

TwinMOS PC2700 & PC3200 (2.5-3-3-8): Samsung TCB3, TCC4, CCC...almost anything 
TwinMOS/Winbond PC3200 (2.5-3-3-6): Really old stuff is Winbond BH-5, most are Winbond CH-5, look at the chips 
TwinMOS Twister PC3200: Most use Hynix D4 chips 
TwinMOS Twister PC4000: Samsung TCCC, Hynix D43            
（出处：http://www.zzzyk.com/）

            
              
                 
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